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  • Aluminum Nitride Ceramic Substrates For Thin Film Circuits

Aluminum Nitride Ceramic Substrates For Thin Film Circuits

  • Product Item : S005
  • Category: Ceramic Substrates
  • Material: Aluminum nitride ceramic
  • Substrate thickness 0.1-3mm
  • Typical thicknesses are 0.254mm, 0.381mm, 0.508mm, and 0.635mm
  • Application: For thin film circuits
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Aluminum Nitride Ceramic Substrates For Thin Film Circuits

Physical Properties of Aluminum Nitride Ceramic
Physical Properties of Aluminum Nitride Ceramic


Substrate size

Typical dimensions of substrate:

Substrate size
Tolerance
50.8*50.8
±0.2
76.2*76.2
±0.3
101.6*101.6
±0.4

Substrate thickness
The thickness of the substrate is 0.1-3mm, with typical thicknesses of 0.254mm, 0.381mm, 0.508mm, and 0.635mm.

±0.005

Thickness
Tolerance of Thickness

Immediate firing type
Grinding type
Polished type
0.127
±0.012
±0.005
±0.005
0.254
±0.025
±0.005
0.381
±0.038
±0.005
±0.005
0.508
±0.050
±0.01
±0.01
0.635
±0.063
±0.01
±0.01
0.762
±0.076
±0.01
±0.01
1.016
±0.10
±0.01
±0.01

Technical level

Substrate type
Surface roughness
Warpage
Immediate firing type
Front side:≤100nm
Opposite side:≤200nm
0.3%
Grinding type
As per customer requirement
0.1%
Polished type
≤25nm
0.1%